Semiconductor Engineering

Innovation And Collaboration In Power Module Packaging: A Thermal Perspective

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.

Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management

Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad ...
Morningstar

Frore Systems Introduces LiquidJet™ Nexus - Defining the AI Thermal Stack for Next-Generation ½ U AI Server Systems like NVIDIA Kyber

SAN JOSE, Calif., March 13, 2026 /PRNewswire/ -- To overcome the thermal barriers limiting AI performance, Frore Systems today unveiled LiquidJet™ Nexus, a new integrated liquid cooling system ...
Democrat and Chronicle

Sheetak Launches CryoSnap™, a Thermoelectric Development Kit That Cuts Peltier Prototyping from Weeks to Minutes

What sets CryoSnap apart is the snap-apart architecture. Once a design proves out, engineers can physically separate the modules they need and carry them into a production build.” — Jon Olsen, Product ...