Communications of the ACM

The LLVM Compiler Infrastructure

LLVM powers the core development tools, operating systems, and most applications at Apple Computer, where it long ago ...
Tech Times

AMD Puts DRAM in the Chip Package to Save Board Space and Dodge the HBM Crunch

AMD’s new Versal Premium Gen 2 Memory on Package integrates up to 32GB of LPDDR5X directly into the chip package for up to ...
PCMag on MSN

I Tested a New Intel 'Wildcat Lake' CPU. Should Laptop Shoppers on a Budget Get Excited?

Intel's Wildcat Lake Core 3 Series chip family is all about low-cost laptops. The first numbers show just where it shines and ...
EDN

CoWoS, wafer-scale and CoWoP: Why AI packaging bottleneck is moving

A basic comparison between CoWoS, wafer-scale integration, and CoWoP establishes distinctions among package substrate, ...
The Next Platform

Three HPC Gurus Ask: Do We Still Need GPUs?

Yes, that simple question is, in the modern Nvidia world that has come to dominate AI training and to a certain extent HPC simulation and modeling, heretical. But given that CPUs are in many cases ...
PCMag on MSN

I Tested 'Wildcat Lake,' Intel's New CPUs for Budget Laptops. Here's the Early Verdict

Intel says its new Wildcat Lake Core 3 Series chip family is built for affordable laptops. My first wave of tests shows ...
InfoQ

Hardwood Promises High-Speed JVM Apache Parquet Processing with Zero Mandatory Dependencies

Hardwood, the project Gunnar Morling kick-started handling of Parquet files in Java, reached version 1. Its multi-threaded approach and zero mandatory external dependencies promise a simpler, more ...