Huawei details LogicFolding architecture, claiming 55% higher transistor density without using a smaller chip process.
Spirit Electronics Announces Managed Access to U.S.-Based Advanced Semiconductor Manufacturing for Aerospace and Defense ...
Apple announced a $30 billion deal to design chips made in the United States by Broadcom. It’s part of Apple’s continued ...
The story so far: On December 15, the Ministry of Electronics and Information Technology (MEITY) announced the launch of DHRUV64, an indigenous microprocessor that it said would strengthen the ...
With Japanese Prime Minister Sanae Takaichi’s visit to India from July 1 to 3 underway, the meeting between PM Modi and the ...
IBM has announced a new chip design that can pack 100 billion transistors into a single silicon chip the size of a fingernail ...
Europe's semiconductor sector saw strong investment in 2025, with funding flowing into AI chips, photonics, advanced memory, ...
Chinese researchers, in collaboration with Huawei Technologies, have built the world’s first parallel processor using a two-dimensional (2D) semiconductor. As silicon devices approach their physical ...
As a spin-off of Space technology, ISRO develops an intelligent artificial limb likely to be commercialised soon, expectedly cheaper by about ten times, benefitting above-knee amputees to walk with a ...
Abstract: Over the last 25 years, the use of caches has advanced significantly in mainstream microprocessors to address the memory wall challenge. As we transformed microprocessors from single-core to ...
Take a look at the essential events, concepts, terms, quotes, or phenomena every day and brush up your knowledge. Here’s your UPSC Current Affairs knowledge nugget for today on India’s first 3D chip ...
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